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1 Ergebnisse
1
Simplified Assembly of Through-Silicon-Via Integrated Ion T..:
Zhao, Peng
;
Li, Hong Yu
;
Likforman, Jean-Pierre
...
info:eu-repo/semantics/altIdentifier/doi/10.1109/TCPMT.2023.3309831. , 2023
Link:
https://hal.science/hal-04307922
RT Journal T1 <Title>Simplified Assembly of Through-Silicon-Via Integrated Ion Traps</Title> UL https://suche.suub.uni-bremen.de/peid=base-ftccsdartic:oai:HAL:hal-04307922v1&Exemplar=1&LAN=DE A1 Zhao, Peng A1 Li, Hong Yu A1 Likforman, Jean-Pierre A1 Henner, Theo A1 Lim, Yu Dian A1 Hu, Liang Xing A1 Seit, Wen Wei A1 Luca, Guidoni A1 Tan, Chuan Seng PB HAL CCSD; Institute of Electrical and Electronics Engineers YR 2023 K1 Ceramic pin grid array (CPGA) K1 redistribution layer (RDL) K1 surface electrode ion trap K1 through-silicon via (TSV) K1 [PHYS]Physics [physics] K1 [SPI]Engineering Sciences [physics] JF info:eu-repo/semantics/altIdentifier/doi/10.1109/TCPMT.2023.3309831 LK http://dx.doi.org/https://hal.science/hal-04307922 DO https://hal.science/hal-04307922 SF ELIB - SuUB Bremen
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