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1 Ergebnisse
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The Effect of Bi and Zn Additives on Sn-Ag-Cu Lead-Free Sol..:
Yubin Kang
;
Jin-Ju Choi
;
Dae-Guen Kim
.
https://www.mdpi.com/2075-4701/12/8/1245. , 2022
Link:
https://doi.org/10.3390/met12081245
RT Journal T1
The Effect of Bi and Zn Additives on Sn-Ag-Cu Lead-Free Solder Alloys for Ag Reduction
UL https://suche.suub.uni-bremen.de/peid=base-ftdoajarticles:oai:doaj.org_article:0fe389bcee354df9b0d60f6f9b812103&Exemplar=1&LAN=DE A1 Yubin Kang A1 Jin-Ju Choi A1 Dae-Guen Kim A1 Hyun-Woo Shim PB MDPI AG YR 2022 K1 Sn-Ag-Cu alloys K1 lead-free solder alloys K1 SAC305 K1 Zn K1 Bi K1 Mining engineering. Metallurgy K1 TN1-997 JF https://www.mdpi.com/2075-4701/12/8/1245 LK http://dx.doi.org/https://doi.org/10.3390/met12081245 DO https://doi.org/10.3390/met12081245 SF ELIB - SuUB Bremen
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