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1 Ergebnisse
1
Microstructure and morphology of the soldering interface of..:
Jin Xiao
;
Xing Tong
;
Jinhui Liang
..
http://www.sciencedirect.com/science/article/pii/S2405844023001597. , 2023
Link:
https://doi.org/10.1016/j.heliyon.2023.e12952
RT Journal T1 <Title>Microstructure and morphology of the soldering interface of Sn–2.0Ag–1.5Zn low Ag content lead-free solder ball and different substrates</Title> UL https://suche.suub.uni-bremen.de/peid=base-ftdoajarticles:oai:doaj.org_article:13a818a6d5ad40b2a753425ebc992ad6&Exemplar=1&LAN=DE A1 Jin Xiao A1 Xing Tong A1 Jinhui Liang A1 Quankun Chen A1 Qiming Tang PB Elsevier YR 2023 K1 Sn–Ag–Zn K1 Lead-free solder K1 Interfacial reaction K1 Low silver solder K1 Solder joint K1 Science (General) K1 Q1-390 K1 Social sciences (General) K1 H1-99 JF http://www.sciencedirect.com/science/article/pii/S2405844023001597 LK http://dx.doi.org/https://doi.org/10.1016/j.heliyon.2023.e12952 DO https://doi.org/10.1016/j.heliyon.2023.e12952 SF ELIB - SuUB Bremen
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