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1 Ergebnisse
1
Study on Electromigration Effects and IMC Formation on Cu–S..:
Zhao-Ying Wang
;
Nhat Minh Dang
;
Po-Hsun Wang
..
https://www.mdpi.com/2076-3417/10/24/8893. , 2020
Link:
https://doi.org/10.3390/app10248893
RT Journal T1
Study on Electromigration Effects and IMC Formation on Cu–Sn Films Due to Current Stress and Temperature
UL https://suche.suub.uni-bremen.de/peid=base-ftdoajarticles:oai:doaj.org_article:17f7b28fe0124018b788f6a3f161f8e0&Exemplar=1&LAN=DE A1 Zhao-Ying Wang A1 Nhat Minh Dang A1 Po-Hsun Wang A1 Terry Yuan-Fang Chen A1 Ming-Tzer Lin PB MDPI AG YR 2020 K1 electromigration K1 intermetallic compound K1 current density K1 Technology K1 T K1 Engineering (General). Civil engineering (General) K1 TA1-2040 K1 Biology (General) K1 QH301-705.5 K1 Physics K1 QC1-999 K1 Chemistry K1 QD1-999 JF https://www.mdpi.com/2076-3417/10/24/8893 LK http://dx.doi.org/https://doi.org/10.3390/app10248893 DO https://doi.org/10.3390/app10248893 SF ELIB - SuUB Bremen
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