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1 Ergebnisse
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Predicting the Wafer Material Removal Rate for Semiconducto..:
Chien-Liang Liu
;
Chun-Jan Tseng
;
Wen-Hoar Hsaio
..
https://www.mdpi.com/2076-3417/12/22/11478. , 2022
Link:
https://doi.org/10.3390/app122211478
RT Journal T1
Predicting the Wafer Material Removal Rate for Semiconductor Chemical Mechanical Polishing Using a Fusion Network
UL https://suche.suub.uni-bremen.de/peid=base-ftdoajarticles:oai:doaj.org_article:1bfef82198ce4317bee55fa14c26590a&Exemplar=1&LAN=DE A1 Chien-Liang Liu A1 Chun-Jan Tseng A1 Wen-Hoar Hsaio A1 Sheng-Hao Wu A1 Shu-Rong Lu PB MDPI AG YR 2022 K1 chemical mechanical polishing (CMP) K1 material removal rate (MRR) K1 fusion network K1 deep learning K1 semiconductor manufacturing K1 Technology K1 T K1 Engineering (General). Civil engineering (General) K1 TA1-2040 K1 Biology (General) K1 QH301-705.5 K1 Physics K1 QC1-999 K1 Chemistry K1 QD1-999 JF https://www.mdpi.com/2076-3417/12/22/11478 LK http://dx.doi.org/https://doi.org/10.3390/app122211478 DO https://doi.org/10.3390/app122211478 SF ELIB - SuUB Bremen
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