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Study of the Solder Characteristics of IGBT Modules Based o..:
Jibing Chen
;
Bowen Liu
;
Maohui Hu
...
https://www.mdpi.com/1996-1944/16/9/3504. , 2023
Link:
https://doi.org/10.3390/ma16093504
RT Journal T1
Study of the Solder Characteristics of IGBT Modules Based on Thermal–Mechanical Coupling Simulation
UL https://suche.suub.uni-bremen.de/peid=base-ftdoajarticles:oai:doaj.org_article:2b2fb5b766374ea38f32e590367177e1&Exemplar=1&LAN=DE A1 Jibing Chen A1 Bowen Liu A1 Maohui Hu A1 Shisen Huang A1 Shanji Yu A1 Yiping Wu A1 Junsheng Yang PB MDPI AG YR 2023 K1 IGBT solder layer K1 packaging reliability K1 interconnection technology K1 thermal conductivity characteristics K1 thermal–mechanical coupling K1 Technology K1 T K1 Electrical engineering. Electronics. Nuclear engineering K1 TK1-9971 K1 Engineering (General). Civil engineering (General) K1 TA1-2040 K1 Microscopy K1 QH201-278.5 K1 Descriptive and experimental mechanics K1 QC120-168.85 JF https://www.mdpi.com/1996-1944/16/9/3504 LK http://dx.doi.org/https://doi.org/10.3390/ma16093504 DO https://doi.org/10.3390/ma16093504 SF ELIB - SuUB Bremen
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