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1 Ergebnisse
1
An Automated Room Temperature Flip-Chip Mounting Process fo..:
Zehua Chen
;
Ulrich Gengenbach
;
Xinnan Liu
...
https://www.mdpi.com/2072-666X/13/4/583. , 2022
Link:
https://doi.org/10.3390/mi13040583
RT Journal T1
An Automated Room Temperature Flip-Chip Mounting Process for Hybrid Printed Electronics
UL https://suche.suub.uni-bremen.de/peid=base-ftdoajarticles:oai:doaj.org_article:2e35b073a63948b5948200cbedf41493&Exemplar=1&LAN=DE A1 Zehua Chen A1 Ulrich Gengenbach A1 Xinnan Liu A1 Alexander Scholz A1 Lukas Zimmermann A1 Jasmin Aghassi-Hagmann A1 Liane Koker PB MDPI AG YR 2022 K1 bump-less bonding K1 conductive adhesive interconnection K1 flip chip K1 standardized interconnection K1 hybrid printed systems K1 room temperature bonding K1 Mechanical engineering and machinery K1 TJ1-1570 JF https://www.mdpi.com/2072-666X/13/4/583 LK http://dx.doi.org/https://doi.org/10.3390/mi13040583 DO https://doi.org/10.3390/mi13040583 SF ELIB - SuUB Bremen
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