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1 Ergebnisse
1
A Low-Cost Passivation for Low Temperature Cu-Cu Bonding Us..:
Tzu-Heng Hung
;
Ping-Jung Liu
;
Chiao-Yen Wang
..
https://ieeexplore.ieee.org/document/10229150/. , 2023
Link:
https://doi.org/10.1109/JEDS.2023.3308368
RT Journal T1
A Low-Cost Passivation for Low Temperature Cu-Cu Bonding Using PVD-Deposited Cu 3 N
UL https://suche.suub.uni-bremen.de/peid=base-ftdoajarticles:oai:doaj.org_article:3ea4d3d903b24f3bbbb06894c9be0536&Exemplar=1&LAN=DE A1 Tzu-Heng Hung A1 Ping-Jung Liu A1 Chiao-Yen Wang A1 Tsai-Fu Chung A1 Kuan-Neng Chen PB IEEE YR 2023 K1 Copper nitride K1 Cu bonding K1 passivation technology K1 PVD-deposited Cu₃N K1 Electrical engineering. Electronics. Nuclear engineering K1 TK1-9971 JF https://ieeexplore.ieee.org/document/10229150/ LK http://dx.doi.org/https://doi.org/10.1109/JEDS.2023.3308368 DO https://doi.org/10.1109/JEDS.2023.3308368 SF ELIB - SuUB Bremen
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