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Construction of novel Cu-α-diimide interactions for enhanci..:
Senjie Jiang
;
Zhijun Bi
;
Junkang Wang
...
http://www.sciencedirect.com/science/article/pii/S2238785423013133. , 2023
Link:
https://doi.org/10.1016/j.jmrt.2023.06.064
RT Journal T1 <Title>Construction of novel Cu-α-diimide interactions for enhancing thermal resistance and dimensional stability of polyimide films</Title> UL https://suche.suub.uni-bremen.de/peid=base-ftdoajarticles:oai:doaj.org_article:4e318bf516674aaea749f00e702a2559&Exemplar=1&LAN=DE A1 Senjie Jiang A1 Zhijun Bi A1 Junkang Wang A1 Jiaxin Zhao A1 Longfei Fan A1 Liyong Tian A1 Yancheng Wu A1 Ningbo Yi A1 Zhenzhen Wei A1 Feng Gan PB Elsevier YR 2023 K1 Polyimide K1 Coordination interaction K1 Thermal resistance K1 Dimensional stability K1 Mining engineering. Metallurgy K1 TN1-997 JF http://www.sciencedirect.com/science/article/pii/S2238785423013133 LK http://dx.doi.org/https://doi.org/10.1016/j.jmrt.2023.06.064 DO https://doi.org/10.1016/j.jmrt.2023.06.064 SF ELIB - SuUB Bremen
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