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1 Ergebnisse
1
Chemical Mechanical Polishing for Oxygen Free Copper with M..:
Ryunosuke SATO
;
Yoshio ICHIDA
;
Yoshitaka MORIMOTO
.
https://www.jstage.jst.go.jp/article/jamdsm/2/4/2_4_685/_pdf/-char/en. , 2008
Link:
https://doi.org/10.1299/jamdsm.2.685
RT Journal T1 <Title>Chemical Mechanical Polishing for Oxygen Free Copper with Manganese Oxide Abrasives</Title> UL https://suche.suub.uni-bremen.de/peid=base-ftdoajarticles:oai:doaj.org_article:4f57d9cc41a541d4963d607a59baf68d&Exemplar=1&LAN=DE A1 Ryunosuke SATO A1 Yoshio ICHIDA A1 Yoshitaka MORIMOTO A1 Kenji SHIMIZU PB The Japan Society of Mechanical Engineers YR 2008 K1 chemical mechanical polishing K1 manganese oxide abrasives K1 oxygen free copper K1 polishing rate K1 surface roughness K1 Engineering machinery K1 tools K1 and implements K1 TA213-215 K1 Mechanical engineering and machinery K1 TJ1-1570 JF https://www.jstage.jst.go.jp/article/jamdsm/2/4/2_4_685/_pdf/-char/en LK http://dx.doi.org/https://doi.org/10.1299/jamdsm.2.685 DO https://doi.org/10.1299/jamdsm.2.685 SF ELIB - SuUB Bremen
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