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1 Ergebnisse
1
Recent Progress in Transient Liquid Phase and Wire Bonding ..:
Hyejun Kang
;
Ashutosh Sharma
;
Jae Pil Jung
https://www.mdpi.com/2075-4701/10/7/934. , 2020
Link:
https://doi.org/10.3390/met10070934
RT Journal T1
Recent Progress in Transient Liquid Phase and Wire Bonding Technologies for Power Electronics
UL https://suche.suub.uni-bremen.de/peid=base-ftdoajarticles:oai:doaj.org_article:68b3b11622484f82b6d7551ae68ad3b9&Exemplar=1&LAN=DE A1 Hyejun Kang A1 Ashutosh Sharma A1 Jae Pil Jung PB MDPI AG YR 2020 K1 power module K1 TLP bonding K1 wire bonding K1 brazing K1 die-attached materials K1 Mining engineering. Metallurgy K1 TN1-997 JF https://www.mdpi.com/2075-4701/10/7/934 LK http://dx.doi.org/https://doi.org/10.3390/met10070934 DO https://doi.org/10.3390/met10070934 SF ELIB - SuUB Bremen
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