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1 Ergebnisse
1
Low Melting Temperature Sn-Bi Solder: Effect of Alloying an..:
Hyejun Kang
;
Sri Harini Rajendran
;
Jae Pil Jung
https://www.mdpi.com/2075-4701/11/2/364. , 2021
Link:
https://doi.org/10.3390/met11020364
RT Journal T1
Low Melting Temperature Sn-Bi Solder: Effect of Alloying and Nanoparticle Addition on the Microstructural, Thermal, Interfacial Bonding, and Mechanical Characteristics
UL https://suche.suub.uni-bremen.de/peid=base-ftdoajarticles:oai:doaj.org_article:70bf1fbc9220427ab66466b3e40208ed&Exemplar=1&LAN=DE A1 Hyejun Kang A1 Sri Harini Rajendran A1 Jae Pil Jung PB MDPI AG YR 2021 K1 low-temperature solder K1 Sn-58wt%Bi K1 melting temperature K1 microstructure K1 mechanical property K1 Mining engineering. Metallurgy K1 TN1-997 JF https://www.mdpi.com/2075-4701/11/2/364 LK http://dx.doi.org/https://doi.org/10.3390/met11020364 DO https://doi.org/10.3390/met11020364 SF ELIB - SuUB Bremen
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