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1 Ergebnisse
1
Horizontal Crack Induced Vertical Crack Formation in Epoxy ..:
S. M. M. S. M. Zain
;
A. Jalar
;
M. Abu Bakar
..
http://www.midem-drustvo.si/Journal%20papers/MIDEM_51(2021)4p261.pdf. , 2021
Link:
https://doi.org/10.33180/InfMIDEM2021.406
RT Journal T1 <Title>Horizontal Crack Induced Vertical Crack Formation in Epoxy Mold Compound for Electronic Packaging</Title> UL https://suche.suub.uni-bremen.de/peid=base-ftdoajarticles:oai:doaj.org_article:8b0fe4a9200c4c078454bb86532ff9de&Exemplar=1&LAN=DE A1 S. M. M. S. M. Zain A1 A. Jalar A1 M. Abu Bakar A1 F. Che Ani A1 M. R. Ramli PB MIDEM Society - Society for Microelectronics, Electronic Components and Materials YR 2021 K1 bga component K1 epoxy mold compound K1 horizontal crack K1 moisture crack K1 moisture sensitivity level 3 K1 vertical crack K1 Electronics K1 TK7800-8360 JF http://www.midem-drustvo.si/Journal%20papers/MIDEM_51(2021)4p261.pdf LK http://dx.doi.org/https://doi.org/10.33180/InfMIDEM2021.406 DO https://doi.org/10.33180/InfMIDEM2021.406 SF ELIB - SuUB Bremen
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