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1 Ergebnisse
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Kerf-Less Exfoliated Thin Silicon Wafer Prepared by Nickel ..:
Hyun-Seock Yang
;
Jiwon Kim
;
Seil Kim
...
https://www.frontiersin.org/article/10.3389/fchem.2018.00600/full. , 2019
Link:
https://doi.org/10.3389/fchem.2018.00600
RT Journal T1 <Title>Kerf-Less Exfoliated Thin Silicon Wafer Prepared by Nickel Electrodeposition for Solar Cells</Title> UL https://suche.suub.uni-bremen.de/peid=base-ftdoajarticles:oai:doaj.org_article:8b78c46998c9405eb0944a4fb76fedf1&Exemplar=1&LAN=DE A1 Hyun-Seock Yang A1 Jiwon Kim A1 Seil Kim A1 Nu Si A. Eom A1 Sangmuk Kang A1 Chang-Soon Han A1 Sung Hae Kim A1 Donggun Lim A1 Jung-Ho Lee A1 Sung Heum Park A1 Jin Woo Choi A1 Chang-Lyoul Lee A1 Bongyoung Yoo A1 Jae-Hong Lim PB Frontiers Media S.A. YR 2019 K1 ultra-thin silicon wafer K1 spalling K1 stressor layer K1 kerf loss K1 edge slope K1 electrodeposition K1 Chemistry K1 QD1-999 JF https://www.frontiersin.org/article/10.3389/fchem.2018.00600/full LK http://dx.doi.org/https://doi.org/10.3389/fchem.2018.00600 DO https://doi.org/10.3389/fchem.2018.00600 SF ELIB - SuUB Bremen
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