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1 Ergebnisse
1
High thermal conductivity and remarkable damping composite ..:
Sheng-Chang Ding
;
Jian-Feng Fan
;
Dong-Yi He
...
http://www.sciencedirect.com/science/article/pii/S2709472322000119. , 2022
Link:
https://doi.org/10.1016/j.chip.2022.100013
RT Journal T1 <Title>High thermal conductivity and remarkable damping composite gels as thermal interface materials for heat dissipation of chip</Title> UL https://suche.suub.uni-bremen.de/peid=base-ftdoajarticles:oai:doaj.org_article:911e6f8923aa41479965535e46f9d9f7&Exemplar=1&LAN=DE A1 Sheng-Chang Ding A1 Jian-Feng Fan A1 Dong-Yi He A1 Lin-Feng Cai A1 Xiang-Liang Zeng A1 Lin-Lin Ren A1 Guo-Ping Du A1 Xiao-Liang Zeng A1 Rong Sun PB Elsevier YR 2022 K1 Thermal interface materials K1 Composite gels K1 Damping K1 Thermal conductivity K1 Dangling chains K1 Information technology K1 T58.5-58.64 JF http://www.sciencedirect.com/science/article/pii/S2709472322000119 LK http://dx.doi.org/https://doi.org/10.1016/j.chip.2022.100013 DO https://doi.org/10.1016/j.chip.2022.100013 SF ELIB - SuUB Bremen
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