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1 Ergebnisse
1
Transient liquid phase bonding of silicon and direct bond c..:
Hyejun Kang
;
Ashutosh Sharma
;
Jung-Hyun Lee
.
https://doi.org/10.1088/2053-1591/abd5d9. , 2021
Link:
https://doi.org/10.1088/2053-1591/abd5d9
RT Journal T1
Transient liquid phase bonding of silicon and direct bond copper via electroplating of tin-copper interlayers for power device applications
UL https://suche.suub.uni-bremen.de/peid=base-ftdoajarticles:oai:doaj.org_article:ccced36c84014f10912c28fc610c033e&Exemplar=1&LAN=DE A1 Hyejun Kang A1 Ashutosh Sharma A1 Jung-Hyun Lee A1 Jae Pil Jung PB IOP Publishing YR 2021 K1 Sn–Cu K1 electroplating K1 Si-chip K1 shear strength K1 TLP bonding K1 Materials of engineering and construction. Mechanics of materials K1 TA401-492 K1 Chemical technology K1 TP1-1185 JF https://doi.org/10.1088/2053-1591/abd5d9 LK http://dx.doi.org/https://doi.org/10.1088/2053-1591/abd5d9 DO https://doi.org/10.1088/2053-1591/abd5d9 SF ELIB - SuUB Bremen
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