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1 Ergebnisse
1
Improving Thermal Conductivity and Tribological Performance..:
Chen Liu
;
Jingfu Song
;
Gai Zhao
..
https://www.mdpi.com/2072-666X/14/3/616. , 2023
Link:
https://doi.org/10.3390/mi14030616
RT Journal T1
Improving Thermal Conductivity and Tribological Performance of Polyimide by Filling Cu, CNT, and Graphene
UL https://suche.suub.uni-bremen.de/peid=base-ftdoajarticles:oai:doaj.org_article:d76c46e3df044ca79a8c1658a87dd398&Exemplar=1&LAN=DE A1 Chen Liu A1 Jingfu Song A1 Gai Zhao A1 Yuhang Yin A1 Qingjun Ding PB MDPI AG YR 2023 K1 polyimide K1 copper K1 carbon nanotubes K1 graphene nanosheets K1 molecular dynamics simulation K1 Mechanical engineering and machinery K1 TJ1-1570 JF https://www.mdpi.com/2072-666X/14/3/616 LK http://dx.doi.org/https://doi.org/10.3390/mi14030616 DO https://doi.org/10.3390/mi14030616 SF ELIB - SuUB Bremen
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