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1 Ergebnisse
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Enhanced thermal conductivity and dielectric properties in ..:
Dong-Li Zhang
;
Sheng-Nan Liu
;
Hui-Wu Cai
...
http://www.sciencedirect.com/science/article/pii/S2352847820301969. , 2020
Link:
https://doi.org/10.1016/j.jmat.2020.06.013
RT Journal T1 <Title>Enhanced thermal conductivity and dielectric properties in electrostatic self-assembly 3D pBN@nCNTs fillers loaded in epoxy resin composites</Title> UL https://suche.suub.uni-bremen.de/peid=base-ftdoajarticles:oai:doaj.org_article:e9e0566f74184517895f8cf025b9394f&Exemplar=1&LAN=DE A1 Dong-Li Zhang A1 Sheng-Nan Liu A1 Hui-Wu Cai A1 Qi-Kun Feng A1 Shao-Long Zhong A1 Jun-Wei Zha A1 Zhi-Min Dang PB Elsevier YR 2020 K1 Thermal conductivity K1 Dielectric permittivity K1 Composites K1 Electrostatic self-assembly K1 Materials of engineering and construction. Mechanics of materials K1 TA401-492 JF http://www.sciencedirect.com/science/article/pii/S2352847820301969 LK http://dx.doi.org/https://doi.org/10.1016/j.jmat.2020.06.013 DO https://doi.org/10.1016/j.jmat.2020.06.013 SF ELIB - SuUB Bremen
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