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1 Ergebnisse
1
Enhanced Thermal Conductivity of Epoxy Composites Filled wi..:
William Anderson Lee Sanchez
;
Chen-Yang Huang
;
Jian-Xun Chen
...
https://www.mdpi.com/2073-4360/13/1/147. , 2021
Link:
https://doi.org/10.3390/polym13010147
RT Journal T1
Enhanced Thermal Conductivity of Epoxy Composites Filled with Al 2 O 3 /Boron Nitride Hybrids for Underfill Encapsulation Materials
UL https://suche.suub.uni-bremen.de/peid=base-ftdoajarticles:oai:doaj.org_article:f0615f7bbcac4277a8de86890404b496&Exemplar=1&LAN=DE A1 William Anderson Lee Sanchez A1 Chen-Yang Huang A1 Jian-Xun Chen A1 Yu-Chian Soong A1 Ying-Nan Chan A1 Kuo-Chan Chiou A1 Tzong-Ming Lee A1 Chih-Chia Cheng A1 Chih-Wei Chiu PB MDPI AG YR 2021 K1 underfill encapsulation K1 aluminum oxide K1 boron nitride K1 hybrid filler K1 thermal conductivity K1 coefficient of thermal expansion K1 Organic chemistry K1 QD241-441 JF https://www.mdpi.com/2073-4360/13/1/147 LK http://dx.doi.org/https://doi.org/10.3390/polym13010147 DO https://doi.org/10.3390/polym13010147 SF ELIB - SuUB Bremen
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