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1 Ergebnisse
1
A Review on the Fabrication and Reliability of Three-Dimens..:
Do Hoon Cho
;
Seong Min Seo
;
Jang Baeg Kim
..
https://www.mdpi.com/2075-4701/11/10/1664. , 2021
Link:
https://doi.org/10.3390/met11101664
RT Journal T1
A Review on the Fabrication and Reliability of Three-Dimensional Integration Technologies for Microelectronic Packaging: Through-Si-via and Solder Bumping Process
UL https://suche.suub.uni-bremen.de/peid=base-ftdoajarticles:oai:doaj.org_article:f6b3a906045f40c4b4f88ff358fdf842&Exemplar=1&LAN=DE A1 Do Hoon Cho A1 Seong Min Seo A1 Jang Baeg Kim A1 Sri Harini Rajendran A1 Jae Pil Jung PB MDPI AG YR 2021 K1 through-Si-via (TSV) K1 solder bump K1 3-dimensional integration K1 reliability K1 Mining engineering. Metallurgy K1 TN1-997 JF https://www.mdpi.com/2075-4701/11/10/1664 LK http://dx.doi.org/https://doi.org/10.3390/met11101664 DO https://doi.org/10.3390/met11101664 SF ELIB - SuUB Bremen
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