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1 Ergebnisse
1
Transient Liquid Phase Bonding of Copper Using Sn Coated Cu..:
Sri Harini Rajendran
;
Jung Do Hyun
;
Jeon Wook Sang
.
https://www.mdpi.com/2076-3417/9/3/529. , 2019
Link:
https://doi.org/10.3390/app9030529
RT Journal T1
Transient Liquid Phase Bonding of Copper Using Sn Coated Cu MWCNT Composite Powders for Power Electronics
UL https://suche.suub.uni-bremen.de/peid=base-ftdoajarticles:oai:doaj.org_article:fb3cd0d3e4d3493aa239272a32bc8fd8&Exemplar=1&LAN=DE A1 Sri Harini Rajendran A1 Jung Do Hyun A1 Jeon Wook Sang A1 Jung Jae Pil PB MDPI AG YR 2019 K1 Transient liquid phase (TLP) bonding K1 Cu3Sn-multi-walled carbon nanotube K1 shear test K1 Technology K1 T K1 Engineering (General). Civil engineering (General) K1 TA1-2040 K1 Biology (General) K1 QH301-705.5 K1 Physics K1 QC1-999 K1 Chemistry K1 QD1-999 JF https://www.mdpi.com/2076-3417/9/3/529 LK http://dx.doi.org/https://doi.org/10.3390/app9030529 DO https://doi.org/10.3390/app9030529 SF ELIB - SuUB Bremen
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