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1 Ergebnisse
1
A Lab-Scale Alternative Interconnection Solution of Semicon..:
Ménager, Ludovic
;
Soueidan, Maher
;
Allard, Bruno
..
info:eu-repo/semantics/altIdentifier/doi/10.1109/TPEL.2010.2041557. , 2010
Link:
https://hal.science/hal-00476271
RT Journal T1 <Title>A Lab-Scale Alternative Interconnection Solution of Semiconductor Dice Compatible with Power Modules 3-D Integration</Title> UL https://suche.suub.uni-bremen.de/peid=base-ftecolecentrlyon:oai:HAL:hal-00476271v1&Exemplar=1&LAN=DE A1 Ménager, Ludovic A1 Soueidan, Maher A1 Allard, Bruno A1 Bley, Vincent A1 Schlegel, Benoît PB HAL CCSD; Institute of Electrical and Electronics Engineers YR 2010 K1 power density K1 three-dimensional packaging K1 transient liquid phase bonding K1 Assembly K1 Bonding K1 Copper K1 Resists K1 Semiconductor die K1 Three dimensional displays K1 Tin K1 Wire K1 electroplating K1 [SPI.NRJ]Engineering Sciences [physics]/Electric power JF info:eu-repo/semantics/altIdentifier/doi/10.1109/TPEL.2010.2041557 LK http://dx.doi.org/https://hal.science/hal-00476271 DO https://hal.science/hal-00476271 SF ELIB - SuUB Bremen
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