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1 Ergebnisse
1
Hier-3D: A Hierarchical Physical Design Methodology for Fac..:
Agnesina, Anthony
;
Brunion, Moritz
;
García-Ortiz, Alberto
...
info:eu-repo/semantics/altIdentifier/doi/10.1145/3531437.3539702. , 2022
Link:
https://hdl.handle.net/20.500.11850/567773
RT Journal T1
Hier-3D: A Hierarchical Physical Design Methodology for Face-to-Face-Bonded 3D ICs
UL https://suche.suub.uni-bremen.de/peid=base-ftethz:oai:www.research-collection.ethz.ch:20.500.11850_567773&Exemplar=1&LAN=DE A1 Agnesina, Anthony A1 Brunion, Moritz A1 García-Ortiz, Alberto A1 Catthoor, Francky A1 Milojevic, Dragomir A1 Komalan, Manu A1 Cavalcante, Matheus A1 Riedel, Samuel A1 id_orcid:0 000-0002-5772-6377 A1 Benini, Luca A1 id_orcid:0 000-0001-8068-3806 PB Association for Computing Machinery YR 2022 K1 Hier-3D K1 Physical Design Methodology K1 Wafer-level Bonding K1 Faceto-Face (F2F) Bonded 3D ICs JF info:eu-repo/semantics/altIdentifier/doi/10.1145/3531437.3539702 LK http://dx.doi.org/https://hdl.handle.net/20.500.11850/567773 DO https://hdl.handle.net/20.500.11850/567773 SF ELIB - SuUB Bremen
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