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1 Ergebnisse
1
Towards a Common Mode Current Free Packaging Solution for H..:
Mathieu de Vienne, Cédric
;
Asllani, Besar
;
Reynes, Hugo
...
hal-04147021. , 2023
Link:
https://hal.science/hal-04147021
RT Journal T1
Towards a Common Mode Current Free Packaging Solution for High Voltage Series Connected SiC MOSFET Switches
UL https://suche.suub.uni-bremen.de/peid=base-ftinsalyonhal:oai:HAL:hal-04147021v1&Exemplar=1&LAN=DE A1 Mathieu de Vienne, Cédric A1 Asllani, Besar A1 Reynes, Hugo A1 Guillet, Martin A1 Al-Hinaai, Amin Salim Obaid A1 Lefranc, Pierre A1 Buttay, Cyril A1 Lefebvre, Bruno A1 Jeannin, Pierre-Olivier A1 Huesgen, Till PB HAL CCSD YR 2023 K1 [SPI]Engineering Sciences [physics] JF hal-04147021 LK http://dx.doi.org/https://hal.science/hal-04147021 DO https://hal.science/hal-04147021 SF ELIB - SuUB Bremen
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