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Wafer-level heterogeneous 3D integration for MEMS and NEMS:
Niklaus, Frank
;
Lapisa, Martin
;
Bleiker, Simon J
...
Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012, p. 247-252. , 2012
Link:
http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-10150
RT Journal T1 <Title>Wafer-level heterogeneous 3D integration for MEMS and NEMS</Title> UL https://suche.suub.uni-bremen.de/peid=base-ftkthstockholm:oai:DiVA.org:kth-101501&Exemplar=1&LAN=DE A1 Niklaus, Frank A1 Lapisa, Martin A1 Bleiker, Simon J A1 Dubois, Valentin A1 Roxhed, Niclas A1 Fischer, Andreas A1 Forsberg, Fredrik A1 Stemme, Göran A1 Grogg, Daniel A1 Despont, Michel PB KTH, Mikrosystemteknik; KTH, Mikro- och nanosystemteknik YR 2012 K1 MEMS K1 microelectromechanical system K1 More-than-Moore K1 nano-electromechanical system K1 NEMS K1 self-assembly K1 transfer printing K1 wafer-level heterogeneous integration K1 Engineering and Technology K1 Teknik och teknologier JF Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012, p. 247-252 LK http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-101501 DO http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-101501 SF ELIB - SuUB Bremen
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