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1 Ergebnisse
1
Wafer-Level Vacuum Sealing by Transfer Bonding of Silicon C..:
Wang, Xiaojing
;
Bleiker, Simon J
;
Edinger, Pierre
...
Journal of microelectromechanical systems, 1057-7157, 2019, 28:3, s. 460-471. , 2019
Link:
http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-25063
RT Journal T1
Wafer-Level Vacuum Sealing by Transfer Bonding of Silicon Caps for Small Footprint and Ultra-Thin MEMS Packages
UL https://suche.suub.uni-bremen.de/peid=base-ftkthstockholm:oai:DiVA.org:kth-250639&Exemplar=1&LAN=DE A1 Wang, Xiaojing A1 Bleiker, Simon J A1 Edinger, Pierre A1 Errando-Herranz, Carlos A1 Roxhed, Niclas A1 Stemme, Göran A1 Gylfason, Kristinn A1 Niklaus, Frank PB KTH, Mikro- och nanosystemteknik YR 2019 K1 Vacuum K1 hermetic K1 packaging K1 sealing K1 MEMS K1 ultra-thin package K1 small footprint K1 transfer bonding K1 3D integration K1 flip chip K1 aluminum K1 gold K1 thermo-compression bonding K1 Other Electrical Engineering K1 Electronic Engineering K1 Information Engineering K1 Annan elektroteknik och elektronik JF Journal of microelectromechanical systems, 1057-7157, 2019, 28:3, s. 460-471 LK http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-250639 DO http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-250639 SF ELIB - SuUB Bremen
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