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1 Ergebnisse
1
Interfacial intermetallic compounds growth kinetics and mec..:
Yi Chen
;
Han Jiang
;
Zhaoxia Zhou
.
2134/25266787.v1. , 2024
Link:
https://figshare.com/articles/journal_contribution/Int..
RT Journal T1
Interfacial intermetallic compounds growth kinetics and mechanical characteristics of Ga-Cu interconnects prepared via transient liquid phase bonding
UL https://suche.suub.uni-bremen.de/peid=base-ftloughboroughun:oai:figshare.com:article_25266787&Exemplar=1&LAN=DE A1 Yi Chen A1 Han Jiang A1 Zhaoxia Zhou A1 Changqing Liu YR 2024 K1 Macromolecular and materials chemistry K1 Materials engineering K1 Nanotechnology K1 Transient liquid phase bonding K1 Liquid Ga metal K1 Cu-Ga intermetallic compounds K1 Growth kinetics K1 Voids formation K1 Shear strength JF 2134/25266787.v1 LK http://dx.doi.org/https://figshare.com/articles/journal_contribution/Interfacial_intermetallic_compounds_growth_kinetics_and_mechanical_characteristics_of_Ga-Cu_interconnects_prepared_via_transient_liquid_phase_bonding/25266787 DO https://figshare.com/articles/journal_contribution/Interfacial_intermetallic_compounds_growth_kinetics_and_mechanical_characteristics_of_Ga-Cu_interconnects_prepared_via_transient_liquid_phase_bonding/25266787 SF ELIB - SuUB Bremen
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