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1 Ergebnisse
1
Formation and homogenisation of Sn-Cu interconnects by self..:
Wenbo Zhu
;
Xiaoting Wang
;
Changqing Liu
..
2134/37573. , 2019
Link:
https://figshare.com/articles/journal_contribution/For..
RT Journal T1
Formation and homogenisation of Sn-Cu interconnects by self-propagated exothermic reactive bonding
UL https://suche.suub.uni-bremen.de/peid=base-ftloughboroughun:oai:figshare.com:article_9563135&Exemplar=1&LAN=DE A1 Wenbo Zhu A1 Xiaoting Wang A1 Changqing Liu A1 Zhaoxia Zhou A1 Fengshun Wu YR 2019 K1 Mechanical Engineering K1 Mechanical Engineering not elsewhere classified K1 SnCu interconnects K1 Al-Ni NanoFoil K1 Exothermic reactive bonding K1 Non-equilibrium metastable phases K1 Interfacial reactions K1 Homogenisation JF 2134/37573 LK http://dx.doi.org/https://figshare.com/articles/journal_contribution/Formation_and_homogenisation_of_Sn-Cu_interconnects_by_self-propagated_exothermic_reactive_bonding/9563135 DO https://figshare.com/articles/journal_contribution/Formation_and_homogenisation_of_Sn-Cu_interconnects_by_self-propagated_exothermic_reactive_bonding/9563135 SF ELIB - SuUB Bremen
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