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1 Ergebnisse
1
Effect of Stiffening the Printed Circuit Board in the Fatig..:
Sushil Doranga
;
Matthew Schuldt
;
Mukunda Khanal
Manufacturing Processes and Systems. , 2022
Link:
https://doi.org/10.3390/ma15186208
RT Journal T1
Effect of Stiffening the Printed Circuit Board in the Fatigue Life of the Solder Joint
UL https://suche.suub.uni-bremen.de/peid=base-ftmdpi:oai:mdpi.com:_1996-1944_15_18_6208_&Exemplar=1&LAN=DE A1 Sushil Doranga A1 Matthew Schuldt A1 Mukunda Khanal PB Multidisciplinary Digital Publishing Institute YR 2022 K1 resonance test K1 fatigue K1 solder joint K1 board thickness JF Manufacturing Processes and Systems LK http://dx.doi.org/https://doi.org/10.3390/ma15186208 DO https://doi.org/10.3390/ma15186208 SF ELIB - SuUB Bremen
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