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1 Ergebnisse
1
Fan-Out Wafer and Panel Level Packaging as Packaging Platfo..:
Tanja Braun
;
Karl-Friedrich Becker
;
Ole Hoelck
...
A:Physics. , 2019
Link:
https://doi.org/10.3390/mi10050342
RT Journal T1
Fan-Out Wafer and Panel Level Packaging as Packaging Platform for Heterogeneous Integration
UL https://suche.suub.uni-bremen.de/peid=base-ftmdpi:oai:mdpi.com:_2072-666X_10_5_342_&Exemplar=1&LAN=DE A1 Tanja Braun A1 Karl-Friedrich Becker A1 Ole Hoelck A1 Steve Voges A1 Ruben Kahle A1 Marc Dreissigacker A1 Martin Schneider-Ramelow PB Multidisciplinary Digital Publishing Institute YR 2019 K1 fan-out wafer level packaging K1 panel level packaging K1 heterogeneous integration JF A:Physics LK http://dx.doi.org/https://doi.org/10.3390/mi10050342 DO https://doi.org/10.3390/mi10050342 SF ELIB - SuUB Bremen
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