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Mechanical Durability of Flexible Printed Circuit Boards Co..:
Jeongah Kim
;
Bo-Young Kim
;
Seong Dae Park
...
https://dx.doi.org/10.3390/mi12080943. , 2021
Link:
https://doi.org/10.3390/mi12080943
RT Journal T1
Mechanical Durability of Flexible Printed Circuit Boards Containing Thin Coverlays Fabricated with Poly(Amide-Imide-Urethane)/Epoxy Interpenetrating Networks
UL https://suche.suub.uni-bremen.de/peid=base-ftmdpi:oai:mdpi.com:_2072-666X_12_8_943_&Exemplar=1&LAN=DE A1 Jeongah Kim A1 Bo-Young Kim A1 Seong Dae Park A1 Ji-Hun Seo A1 Chan-Jae Lee A1 Myong Jae Yoo A1 Youngmin Kim PB Multidisciplinary Digital Publishing Institute YR 2021 K1 flexible printed circuit boards K1 coverlay K1 poly(amide-imide-urethane) K1 interpenetrating network K1 MIT folding test JF https://dx.doi.org/10.3390/mi12080943 LK http://dx.doi.org/https://doi.org/10.3390/mi12080943 DO https://doi.org/10.3390/mi12080943 SF ELIB - SuUB Bremen
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