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1 Ergebnisse
1
Electromagnetic Interference Shield of Highly Thermal-Condu..:
Jaeyeon Kim
;
Suyeong Lee
;
Changho Kim
...
Polymer Processing and Engineering. , 2020
Link:
https://doi.org/10.3390/polym12081805
RT Journal T1
Electromagnetic Interference Shield of Highly Thermal-Conducting, Light-Weight, and Flexible Electrospun Nylon 66 Nanofiber-Silver Multi-Layer Film
UL https://suche.suub.uni-bremen.de/peid=base-ftmdpi:oai:mdpi.com:_2073-4360_12_8_1805_&Exemplar=1&LAN=DE A1 Jaeyeon Kim A1 Suyeong Lee A1 Changho Kim A1 Yeongcheol Park A1 Mi-Hyun Kim A1 Jae Hun Seol PB Multidisciplinary Digital Publishing Institute YR 2020 K1 electrospun nylon 66 nanofiber K1 nanofiber-Ag multi-layer composite K1 electromagnetic interference shielding K1 heat dissipation K1 thermal conductivity JF Polymer Processing and Engineering LK http://dx.doi.org/https://doi.org/10.3390/polym12081805 DO https://doi.org/10.3390/polym12081805 SF ELIB - SuUB Bremen
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