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1 Ergebnisse
1
Cu-Based Thermocompression Bonding and Cu/Dielectric Hybrid..:
Yuan-Chiu Huang
;
Yu-Xian Lin
;
Chien-Kang Hsiung
..
Nanoelectronics, Nanosensors and Devices. , 2023
Link:
https://doi.org/10.3390/nano13172490
RT Journal T1
Cu-Based Thermocompression Bonding and Cu/Dielectric Hybrid Bonding for Three-Dimensional Integrated Circuits (3D ICs) Application
UL https://suche.suub.uni-bremen.de/peid=base-ftmdpi:oai:mdpi.com:_2079-4991_13_17_2490_&Exemplar=1&LAN=DE A1 Yuan-Chiu Huang A1 Yu-Xian Lin A1 Chien-Kang Hsiung A1 Tzu-Heng Hung A1 Kuan-Neng Chen PB Multidisciplinary Digital Publishing Institute YR 2023 K1 3D ICs K1 advanced packaging K1 Cu-Cu bonding K1 hybrid bonding K1 low-temperature bonding JF Nanoelectronics, Nanosensors and Devices LK http://dx.doi.org/https://doi.org/10.3390/nano13172490 DO https://doi.org/10.3390/nano13172490 SF ELIB - SuUB Bremen
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