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The Seebeck Coefficient of Sputter Deposited Metallic Thin ..:
Florian Cougnon
;
Diederik Depla
https://dx.doi.org/10.3390/coatings9050299. , 2019
Link:
https://doi.org/10.3390/coatings9050299
RT Journal T1
The Seebeck Coefficient of Sputter Deposited Metallic Thin Films: The Role of Process Conditions
UL https://suche.suub.uni-bremen.de/peid=base-ftmdpi:oai:mdpi.com:_2079-6412_9_5_299_&Exemplar=1&LAN=DE A1 Florian Cougnon A1 Diederik Depla PB Multidisciplinary Digital Publishing Institute YR 2019 K1 Seebeck coefficient K1 background pressure K1 impurities K1 discharge current K1 domain size K1 layer thickness K1 sputter deposition JF https://dx.doi.org/10.3390/coatings9050299 LK http://dx.doi.org/https://doi.org/10.3390/coatings9050299 DO https://doi.org/10.3390/coatings9050299 SF ELIB - SuUB Bremen
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