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1 Ergebnisse
1
Thermal ALD of Cu via Reduction of CuxO films for the Advan..:
Mueller, Steve
;
Waechtler, Thomas
;
Hofmann, Lutz
...
10.1109/SCD.2011.6068736. , 2012
Link:
https://nbn-resolving.org/urn:nbn:de:bsz:ch1-qucosa-84..
RT Journal T1
Thermal ALD of Cu via Reduction of CuxO films for the Advanced Metallization in Spintronic and ULSI Interconnect Systems
UL https://suche.suub.uni-bremen.de/peid=base-ftmonarchchem:oai:qucosa:de:qucosa:19675&Exemplar=1&LAN=DE A1 Mueller, Steve A1 Waechtler, Thomas A1 Hofmann, Lutz A1 Tuchscherer, Andre A1 Mothes, Robert A1 Gordan, Ovidiu A1 Lehmann, Daniel A1 Haidu, Francisc A1 Ogiewa, Marcel A1 Gerlich, Lukas A1 Ding, Shao-Feng A1 Schulz, Stefan E A1 Gessner, Thomas A1 Lang, Heinrich A1 Zahn, Dietrich R.T A1 Qu, Xin-Ping PB Technische Universität Chemnitz; IEEE YR 2012 K1 info:eu-repo/classification/ddc/600 K1 ddc:600 K1 info:eu-repo/classification/ddc/620 K1 ddc:620 K1 info:eu-repo/classification/ddc/621 K1 ddc:621 K1 info:eu-repo/classification/ddc/667 K1 ddc:667 K1 Atomlagenabscheidung K1 Kupferoxid K1 Ruthenium K1 Metallisieren K1 Galvanische Beschichtung K1 Kupfer K1 ALD K1 Ameisensäure K1 Wasserstoff K1 Reduktion K1 ULSI K1 Metallisierung K1 Galvanik K1 Spintronik K1 Atomic Layer Deposition K1 Copper Oxide K1 Formic Acid K1 Hydrogen K1 Reduction K1 Interconnect K1 Electrochemical deposition K1 ECD K1 Spintronics JF 10.1109/SCD.2011.6068736 LK http://dx.doi.org/https://nbn-resolving.org/urn:nbn:de:bsz:ch1-qucosa-84003 DO https://nbn-resolving.org/urn:nbn:de:bsz:ch1-qucosa-84003 SF ELIB - SuUB Bremen
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