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Laminar Metal Foam: A Soft and Highly Thermally Conductive ..:

Peng Liu (120506) ; Yingying Luo (319176) ; Jiaman Liu (6368459)...
https://figshare.com/articles/journal_contribution/Laminar_Metal_Foam_A_Soft_and_Highly_Thermally_Conductive_Thermal_Interface_Material_with_a_Reliable_Joint_for_Semiconductor_Packaging/14271409. , 2021

Link: https://doi.org/10.1021/acsami.0c22434.s001

RT Journal
T1 <Title>Laminar Metal Foam: A Soft and Highly Thermally Conductive Thermal Interface Material with a Reliable Joint for Semiconductor Packaging</Title>

UL https://suche.suub.uni-bremen.de/peid=base-ftsmithonian:oai:figshare.com:article_14271409&Exemplar=1&LAN=DE
				
A1 Peng Liu (120506)
A1 Yingying Luo (319176)
A1 Jiaman Liu (6368459)
A1 Sum Wai Chiang (9187284)
A1 Dang Wu (402063)
A1 Wanyu Dai (10358140)
A1 Feiyu Kang (789424)
A1 Wei Lin (6475)
A1 Ching-Ping Wong (1419250)
A1 Cheng Yang (273624)
YR 2021
K1 Molecular Biology
K1 Pharmacology
K1 Biotechnology
K1 Ecology
K1 Inorganic Chemistry
K1 Biological Sciences not elsewhere classified
K1 Physical Sciences not elsewhere classified
K1 laminar structure
K1 Semiconductor Packaging Future
K1 interface materials
K1 joint
K1 Interface Material
K1 indium
K1 packaging technology
K1 Thermally Conductive
K1 silver pastes
K1 conductivity
K1 data center servers
K1 IMCs spread
K1 popcorn problems
K1 semiconductor chips
K1 Reliable Joint
K1 energy conversion systems
K1 chip corners
K1 silicon-TIM-copper package testing
K1 In-based intermetallic compound
K1 management ability
K1 Laminar Metal Foam
K1 stress
JF https://figshare.com/articles/journal_contribution/Laminar_Metal_Foam_A_Soft_and_Highly_Thermally_Conductive_Thermal_Interface_Material_with_a_Reliable_Joint_for_Semiconductor_Packaging/14271409
LK http://dx.doi.org/https://doi.org/10.1021/acsami.0c22434.s001
DO https://doi.org/10.1021/acsami.0c22434.s001
SF ELIB - SuUB Bremen

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