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Generic Approach for Contacting Thermoelectric Solid Soluti..:

Gagan K. Goyal (10698506) ; Titas Dasgupta (6449423)
https://figshare.com/articles/journal_contribution/Generic_Approach_for_Contacting_Thermoelectric_Solid_Solutions_Case_Study_in_n-_and_p_Type_Mg_sub_2_sub_Si_sub_0_3_sub_Sn_sub_0_7_sub_/14482298. , 2021

Link: https://doi.org/10.1021/acsami.0c19485.s001

RT Journal
T1 <Title>Generic Approach for Contacting Thermoelectric Solid Solutions: Case Study in n- and p‑Type Mg 2 Si 0.3 Sn 0.7</Title>

UL https://suche.suub.uni-bremen.de/peid=base-ftsmithonian:oai:figshare.com:article_14482298&Exemplar=1&LAN=DE
				
A1 Gagan K. Goyal (10698506)
A1 Titas Dasgupta (6449423)
YR 2021
K1 Biophysics
K1 Biochemistry
K1 Physiology
K1 Biotechnology
K1 Cancer
K1 Space Science
K1 Chemical Sciences not elsewhere classified
K1 p-doped Mg 2 Si 0.3 Sn 0.7
K1 Various intermetallic phases
K1 contact materials
K1 solution
K1 expansion coefficient values
K1 monoblock sintering technique
K1 formation
K1 MgNi 2 Sn phase
K1 well-bonded crack-free interface
K1 Electrical contact resistance
K1 19 μΩ cm 2
K1 TE material
K1 r c values
JF https://figshare.com/articles/journal_contribution/Generic_Approach_for_Contacting_Thermoelectric_Solid_Solutions_Case_Study_in_n-_and_p_Type_Mg_sub_2_sub_Si_sub_0_3_sub_Sn_sub_0_7_sub_/14482298
LK http://dx.doi.org/https://doi.org/10.1021/acsami.0c19485.s001
DO https://doi.org/10.1021/acsami.0c19485.s001
SF ELIB - SuUB Bremen

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