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Atomic Layer Deposition of Ru for Replacing Cu-Interconnect:

Yohei Kotsugi (11097565) ; Seung-Min Han (7474676) ; Youn-Hye Kim (11097568)...
https://figshare.com/articles/journal_contribution/Atomic_Layer_Deposition_of_Ru_for_Replacing_Cu-Interconnects/14932078. , 1753

Link: https://doi.org/10.1021/acs.chemmater.1c01054.s001

RT Journal
T1 <Title>Atomic Layer Deposition of Ru for Replacing Cu-Interconnects</Title>

UL https://suche.suub.uni-bremen.de/peid=base-ftsmithonian:oai:figshare.com:article_14932078&Exemplar=1&LAN=DE
				
A1 Yohei Kotsugi (11097565)
A1 Seung-Min Han (7474676)
A1 Youn-Hye Kim (11097568)
A1 Taehoon Cheon (6657683)
A1 Dip K. Nandi (1806910)
A1 Rahul Ramesh (1423156)
A1 Neung-Kyung Yu (11097571)
A1 Kirak Son (11097574)
A1 Tomohiro Tsugawa (10959930)
A1 Shigeyuki Ohtake (11097577)
A1 Ryosuke Harada (2510902)
A1 Young-Bae Park (281502)
A1 Bonggeun Shong (1291524)
A1 Soo-Hyun Kim (10655)
YR 1753
K1 Biophysics
K1 Biochemistry
K1 Cell Biology
K1 Biotechnology
K1 Ecology
K1 Developmental Biology
K1 Cancer
K1 Infectious Diseases
K1 Chemical Sciences not elsewhere classified
K1 Atomic Layer Deposition
K1 Ru films
K1 GPC
K1 plan-view transmission electron mic
K1 precursor
K1 deposition
K1 resistivity
K1 Typical self-limiting growth
K1 ALD temperature window
JF https://figshare.com/articles/journal_contribution/Atomic_Layer_Deposition_of_Ru_for_Replacing_Cu-Interconnects/14932078
LK http://dx.doi.org/https://doi.org/10.1021/acs.chemmater.1c01054.s001
DO https://doi.org/10.1021/acs.chemmater.1c01054.s001
SF ELIB - SuUB Bremen

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