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1 Ergebnisse
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Thermal Interface Materials with Both High Through-Plane Th..:
Junwei Li (650607)
;
Yuexing Zhang (11909)
;
Ting Liang (506921)
...
https://figshare.com/articles/journal_contribution/Thermal_Interface_Materials_with_Both_High_Through-Plane_Thermal_Conductivity_and_Excellent_Elastic_Compliance/16920273. , 2021
Link:
https://doi.org/10.1021/acs.chemmater.1c03275.s001
RT Journal T1
Thermal Interface Materials with Both High Through-Plane Thermal Conductivity and Excellent Elastic Compliance
UL https://suche.suub.uni-bremen.de/peid=base-ftsmithonian:oai:figshare.com:article_16920273&Exemplar=1&LAN=DE A1 Junwei Li (650607) A1 Yuexing Zhang (11909) A1 Ting Liang (506921) A1 Xue Bai (129175) A1 Yunsong Pang (3357281) A1 Xiangliang Zeng (6851879) A1 Qinghua Hu (251686) A1 Wendian Tu (11637135) A1 Zhenqiang Ye (8217522) A1 Guoping Du (6851882) A1 Rong Sun (532754) A1 Xiaoliang Zeng (1425379) YR 2021 K1 Biophysics K1 Genetics K1 Molecular Biology K1 Inorganic Chemistry K1 Biological Sciences not elsewhere classified K1 Information Systems not elsewhere classified K1 warpage failure caused K1 usually mutually exclusive K1 strong interfacial strength K1 soft biological tissues K1 minimized negative impact K1 meet specific requirements K1 intrinsic mechanical properties K1 excellent properties result K1 compressive strain similar K1 90 w · K1 thermal interface materials K1 increasingly important role K1 93 kpa stress K1 plane thermal conductivity K1 vertically oriented graphite K1 excellent elastic compliance K1 cpu microprocessor cooling K1 chip temperature comparing K1 high thermal conductivity K1 thermal conductivity K1 microprocessor cooling K1 elastic compliance K1 thermal design K1 stress concentration K1 also important K1 work provides K1 vertical orientation K1 tim made K1 stacking techniques K1 shows high K1 primarily dealt K1 performance tim K1 performance computing K1 optimal tim K1 larger chip K1 higher frequency K1 heat spreader K1 heat sink K1 heat dissipation K1 graphite films K1 cloud computing K1 central issues K1 ai computing K1 226 ) JF https://figshare.com/articles/journal_contribution/Thermal_Interface_Materials_with_Both_High_Through-Plane_Thermal_Conductivity_and_Excellent_Elastic_Compliance/16920273 LK http://dx.doi.org/https://doi.org/10.1021/acs.chemmater.1c03275.s001 DO https://doi.org/10.1021/acs.chemmater.1c03275.s001 SF ELIB - SuUB Bremen
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