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Thermal Interface Materials with Both High Through-Plane Th..:

Junwei Li (650607) ; Yuexing Zhang (11909) ; Ting Liang (506921)...
https://figshare.com/articles/media/Thermal_Interface_Materials_with_Both_High_Through-Plane_Thermal_Conductivity_and_Excellent_Elastic_Compliance/16920279. , 2021

Link: https://doi.org/10.1021/acs.chemmater.1c03275.s003

RT Journal
T1 <Title>Thermal Interface Materials with Both High Through-Plane Thermal Conductivity and Excellent Elastic Compliance</Title>

UL https://suche.suub.uni-bremen.de/peid=base-ftsmithonian:oai:figshare.com:article_16920279&Exemplar=1&LAN=DE
				
A1 Junwei Li (650607)
A1 Yuexing Zhang (11909)
A1 Ting Liang (506921)
A1 Xue Bai (129175)
A1 Yunsong Pang (3357281)
A1 Xiangliang Zeng (6851879)
A1 Qinghua Hu (251686)
A1 Wendian Tu (11637135)
A1 Zhenqiang Ye (8217522)
A1 Guoping Du (6851882)
A1 Rong Sun (532754)
A1 Xiaoliang Zeng (1425379)
YR 2021
K1 Biophysics
K1 Genetics
K1 Molecular Biology
K1 Inorganic Chemistry
K1 Biological Sciences not elsewhere classified
K1 Information Systems not elsewhere classified
K1 warpage failure caused
K1 usually mutually exclusive
K1 strong interfacial strength
K1 soft biological tissues
K1 minimized negative impact
K1 meet specific requirements
K1 intrinsic mechanical properties
K1 excellent properties result
K1 compressive strain similar
K1 90 w ·
K1 thermal interface materials
K1 increasingly important role
K1 93 kpa stress
K1 plane thermal conductivity
K1 vertically oriented graphite
K1 excellent elastic compliance
K1 cpu microprocessor cooling
K1 chip temperature comparing
K1 high thermal conductivity
K1 thermal conductivity
K1 microprocessor cooling
K1 elastic compliance
K1 thermal design
K1 stress concentration
K1 also important
K1 work provides
K1 vertical orientation
K1 tim made
K1 stacking techniques
K1 shows high
K1 primarily dealt
K1 performance tim
K1 performance computing
K1 optimal tim
K1 larger chip
K1 higher frequency
K1 heat spreader
K1 heat sink
K1 heat dissipation
K1 graphite films
K1 cloud computing
K1 central issues
K1 ai computing
K1 226 )
JF https://figshare.com/articles/media/Thermal_Interface_Materials_with_Both_High_Through-Plane_Thermal_Conductivity_and_Excellent_Elastic_Compliance/16920279
LK http://dx.doi.org/https://doi.org/10.1021/acs.chemmater.1c03275.s003
DO https://doi.org/10.1021/acs.chemmater.1c03275.s003
SF ELIB - SuUB Bremen

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