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1 Ergebnisse
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Advances on Thermally Conductive Epoxy‐Based Composites as ..:
Wen, Yingfeng
;
Chen, Chao
;
Ye, Yunsheng
...
Advanced Materials. 34 (2022) 52 - p. , 2022
Link:
https://doi.org/10.1002/adma.202201023
RT Journal T1
Advances on Thermally Conductive Epoxy‐Based Composites as Electronic Packaging Underfill Materials—A Review
UL https://suche.suub.uni-bremen.de/peid=cr-10.1002_adma.202201023&Exemplar=1&LAN=DE A1 Wen, Yingfeng A1 Chen, Chao A1 Ye, Yunsheng A1 Xue, Zhigang A1 Liu, Hongyuan A1 Zhou, Xingping A1 Zhang, Yun A1 Li, Dequn A1 Xie, Xiaolin A1 Mai, Yiu‐Wing PB Wiley YR 2022 SN 0935-9648 SN 1521-4095 JF Advanced Materials VO 34 IS 52 LK http://dx.doi.org/https://doi.org/10.1002/adma.202201023 DO https://doi.org/10.1002/adma.202201023 SF ELIB - SuUB Bremen
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