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1 Ergebnisse
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Fabrication with Semiconductor Packaging Technologies and C..:
Sugahara, Tohru
;
Ekubaru, Yusufu
;
Nong, Ngo Van
...
Advanced Materials Technologies. 4 (2018) 2 - p. , 2018
Link:
https://doi.org/10.1002/admt.201800556
RT Journal T1
Fabrication with Semiconductor Packaging Technologies and Characterization of a Large‐Scale Flexible Thermoelectric Module
UL https://suche.suub.uni-bremen.de/peid=cr-10.1002_admt.201800556&Exemplar=1&LAN=DE A1 Sugahara, Tohru A1 Ekubaru, Yusufu A1 Nong, Ngo Van A1 Kagami, Noriko A1 Ohata, Keiichi A1 Hung, Le Thanh A1 Okajima, Michio A1 Nambu, Shutaro A1 Suganuma, Katsuaki PB Wiley YR 2018 SN 2365-709X SN 2365-709X JF Advanced Materials Technologies VO 4 IS 2 LK http://dx.doi.org/https://doi.org/10.1002/admt.201800556 DO https://doi.org/10.1002/admt.201800556 SF ELIB - SuUB Bremen
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