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Low‐Temperature Atomic Layer Deposition of Copper Metal Thi..:
Lee, Byoung H.
;
Hwang, Jae K.
;
Nam, Jae W.
...
Angewandte Chemie International Edition. 48 (2009) 25 - p. 4536-4539 , 2009
Link:
https://doi.org/10.1002/anie.200900414
RT Journal T1 <Title>Low‐Temperature Atomic Layer Deposition of Copper Metal Thin Films: Self‐Limiting Surface Reaction of Copper Dimethylamino‐2‐propoxide with Diethylzinc</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1002_anie.200900414&Exemplar=1&LAN=DE A1 Lee, Byoung H. A1 Hwang, Jae K. A1 Nam, Jae W. A1 Lee, Song U. A1 Kim, Jun T. A1 Koo, Sang‐M. A1 Baunemann, A. A1 Fischer, Roland A. A1 Sung, Myung M. PB Wiley YR 2009 SN 1433-7851 SN 1521-3773 JF Angewandte Chemie International Edition VO 48 IS 25 SP 4536 OP 4539 LK http://dx.doi.org/https://doi.org/10.1002/anie.200900414 DO https://doi.org/10.1002/anie.200900414 SF ELIB - SuUB Bremen
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