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1 Ergebnisse
1
Shallow trench isolation structure design for through‐silic..:
Wang, Fengjuan
;
Liu, Suiyang
;
Yin, Xiangkun
..
International Journal of Numerical Modelling: Electronic Networks, Devices and Fields. 35 (2022) 4 - p. , 2022
Link:
https://doi.org/10.1002/jnm.2988
RT Journal T1 <Title>Shallow trench isolation structure design for through‐silicon vias stress reduction</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1002_jnm.2988&Exemplar=1&LAN=DE A1 Wang, Fengjuan A1 Liu, Suiyang A1 Yin, Xiangkun A1 Yu, Ningmei A1 Yang, Yuan PB Wiley YR 2022 SN 0894-3370 SN 1099-1204 JF International Journal of Numerical Modelling: Electronic Networks, Devices and Fields VO 35 IS 4 LK http://dx.doi.org/https://doi.org/10.1002/jnm.2988 DO https://doi.org/10.1002/jnm.2988 SF ELIB - SuUB Bremen
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