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1 Ergebnisse
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Numerical Study of Creep Damage Behavior of Thin Film/Subst..:
Xu, BX.
;
Wan, J.S.
;
Zhao, B.
.
Materialwissenschaft und Werkstofftechnik. 36 (2005) 2 - p. 75-79 , 2005
Link:
https://doi.org/10.1002/mawe.200400851
RT Journal T1 <Title>Numerical Study of Creep Damage Behavior of Thin Film/Substrate Systems under Indentation</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1002_mawe.200400851&Exemplar=1&LAN=DE A1 Xu, BX. A1 Wan, J.S. A1 Zhao, B. A1 Yue, ZF. PB Wiley YR 2005 SN 0933-5137 SN 1521-4052 JF Materialwissenschaft und Werkstofftechnik VO 36 IS 2 SP 75 OP 79 LK http://dx.doi.org/https://doi.org/10.1002/mawe.200400851 DO https://doi.org/10.1002/mawe.200400851 SF ELIB - SuUB Bremen
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