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1 Ergebnisse
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Deformation behaviors of flip chip plastic ball grid array ..:
Kim, D. H.
;
Joo, J.
Materialwissenschaft und Werkstofftechnik. 54 (2023) 4 - p. 391-400 , 2023
Link:
https://doi.org/10.1002/mawe.202300008
RT Journal T1 <Title>Deformation behaviors of flip chip plastic ball grid array packages subjected to temperature change using moiré interferometry</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1002_mawe.202300008&Exemplar=1&LAN=DE A1 Kim, D. H. A1 Joo, J. PB Wiley YR 2023 SN 0933-5137 SN 1521-4052 JF Materialwissenschaft und Werkstofftechnik VO 54 IS 4 SP 391 OP 400 LK http://dx.doi.org/https://doi.org/10.1002/mawe.202300008 DO https://doi.org/10.1002/mawe.202300008 SF ELIB - SuUB Bremen
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