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Challenges facing copper‐plated metallisation for silicon p..:
Lennon, Alison
;
Colwell, Jack
;
Rodbell, Kenneth P.
Progress in Photovoltaics: Research and Applications. 27 (2018) 1 - p. 67-97 , 2018
Link:
https://doi.org/10.1002/pip.3062
RT Journal T1 <Title>Challenges facing copper‐plated metallisation for silicon photovoltaics: Insights from integrated circuit technology development</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1002_pip.3062&Exemplar=1&LAN=DE A1 Lennon, Alison A1 Colwell, Jack A1 Rodbell, Kenneth P. PB Wiley YR 2018 SN 1062-7995 SN 1099-159X JF Progress in Photovoltaics: Research and Applications VO 27 IS 1 SP 67 OP 97 LK http://dx.doi.org/https://doi.org/10.1002/pip.3062 DO https://doi.org/10.1002/pip.3062 SF ELIB - SuUB Bremen
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