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1 Ergebnisse
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51‐3: Copper Thin Film Dry Etching Equipment via ECR Plasma..:
Jang, Jin Nyoung
;
Lee, Jong Hwa
;
Jung, Jae Hoon
...
SID Symposium Digest of Technical Papers. 54 (2023) 1 - p. 734-737 , 2023
Link:
https://doi.org/10.1002/sdtp.16665
RT Journal T1 <Title>51‐3: Copper Thin Film Dry Etching Equipment via ECR Plasma Source</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1002_sdtp.16665&Exemplar=1&LAN=DE A1 Jang, Jin Nyoung A1 Lee, Jong Hwa A1 Jung, Jae Hoon A1 Jung, Kiro A1 Lee, Sangheon A1 Kim, Donghoon A1 Hong, Mun‐Pyo A1 Kim, Sang‐Gab A1 Jang, Soo Ouk A1 Kim, Chiwoo PB Wiley YR 2023 SN 0097-966X SN 2168-0159 JF SID Symposium Digest of Technical Papers VO 54 IS 1 SP 734 OP 737 LK http://dx.doi.org/https://doi.org/10.1002/sdtp.16665 DO https://doi.org/10.1002/sdtp.16665 SF ELIB - SuUB Bremen
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