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1 Ergebnisse
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23‐5: Application of Non‐Conductive Paste (NCP)‐assisted bo..:
Dong, Xiaobiao
;
Cao, Xuan
;
Huang, Xiuqi
...
SID Symposium Digest of Technical Papers. 55 (2024) S1 - p. 204-207 , 2024
Link:
https://doi.org/10.1002/sdtp.17038
RT Journal T1 <Title>23‐5: Application of Non‐Conductive Paste (NCP)‐assisted bonding for Interconnection between Micro‐LED and Backplane</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1002_sdtp.17038&Exemplar=1&LAN=DE A1 Dong, Xiaobiao A1 Cao, Xuan A1 Huang, Xiuqi A1 Wang, Kang A1 He, Li A1 Chen, Hang A1 Cui, Yongxin A1 Qian, Xianrui PB Wiley YR 2024 SN 0097-966X SN 2168-0159 JF SID Symposium Digest of Technical Papers VO 55 IS S1 SP 204 OP 207 LK http://dx.doi.org/https://doi.org/10.1002/sdtp.17038 DO https://doi.org/10.1002/sdtp.17038 SF ELIB - SuUB Bremen
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