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Analysis of interface impurities in electroplated Cu layers..:
Klemm, Denis
;
Stangl, Marcel
;
Peeva, Anita
...
Surface and Interface Analysis. 40 (2008) 3-4 - p. 418-422 , 2008
Link:
https://doi.org/10.1002/sia.2743
RT Journal T1
Analysis of interface impurities in electroplated Cu layers by using GD‐OES and TOF‐SIMS
UL https://suche.suub.uni-bremen.de/peid=cr-10.1002_sia.2743&Exemplar=1&LAN=DE A1 Klemm, Denis A1 Stangl, Marcel A1 Peeva, Anita A1 Hoffmann, Volker A1 Wetzig, Klaus A1 Eckert, Jürgen PB Wiley YR 2008 SN 0142-2421 SN 1096-9918 JF Surface and Interface Analysis VO 40 IS 3-4 SP 418 OP 422 LK http://dx.doi.org/https://doi.org/10.1002/sia.2743 DO https://doi.org/10.1002/sia.2743 SF ELIB - SuUB Bremen
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